種植手術(shù)導(dǎo)板樹(shù)脂是一種用于牙科和醫(yī)療領(lǐng)域的光固化3D打印材料，它能夠幫助醫(yī)生在手術(shù)中準(zhǔn)確定位種植體的位置、深度和角度，從而提高手術(shù)的成功率和種植體的長(zhǎng)期穩(wěn)定性。

種植手術(shù)導(dǎo)板樹(shù)脂具有優(yōu)異的生物相容性和高機(jī)械強(qiáng)度，支持高速成型，同時(shí)其高透明度、易于拋光、低吸水率的特點(diǎn)都可以滿足牙科應(yīng)用的需求。

01產(chǎn)品特點(diǎn)

1. 生物相容性

導(dǎo)板樹(shù)脂必須滿足生物相容性的標(biāo)準(zhǔn)，以確保不會(huì)在人體內(nèi)部引起不良反應(yīng)。

2.高機(jī)械強(qiáng)度

導(dǎo)板樹(shù)脂通常具有較高的機(jī)械強(qiáng)度，包括彎曲強(qiáng)度和抗沖擊強(qiáng)度，這使得它能夠承受一定的外力而不發(fā)生斷裂，是制作種植手術(shù)導(dǎo)板等需要高強(qiáng)度應(yīng)用場(chǎng)景的理想材料。

3.低吸水率

導(dǎo)板樹(shù)脂材料具有較低的吸水率，在較為濕潤(rùn)的口腔環(huán)境中，依然能保持模型的尺寸穩(wěn)定性。

4.易于拋光

導(dǎo)板樹(shù)脂表面光滑，易于進(jìn)行拋光處理，以達(dá)到更高的精度和美觀度，對(duì)于口腔科應(yīng)用尤為關(guān)鍵。

5.耐高溫蒸汽滅菌

材料能夠耐受高溫蒸汽滅菌處理，保證在臨床使用前的無(wú)菌要求。

02產(chǎn)品應(yīng)用

正畸導(dǎo)板、手術(shù)導(dǎo)板、功能性保持器、頜墊、咬合板、X光導(dǎo)板、其他正畸附件

03產(chǎn)品參數(shù)

近年來(lái)，基于3D打印技術(shù)開(kāi)發(fā)的數(shù)字化定制齒科解決方案在在口腔診療領(lǐng)域被廣泛應(yīng)用。

導(dǎo)板樹(shù)脂的應(yīng)用過(guò)程簡(jiǎn)單可分為“數(shù)據(jù)采集、診斷性分析、種植體三維設(shè)計(jì)、導(dǎo)板結(jié)構(gòu)設(shè)計(jì)、導(dǎo)板數(shù)據(jù)輸出、導(dǎo)板打印、導(dǎo)板引導(dǎo)下實(shí)施手術(shù)”等步驟。

使用牙科導(dǎo)板樹(shù)脂進(jìn)行3D打印得到的模型，精度更高，尺寸穩(wěn)定性更好，可以提高在植入手術(shù)中種植體的植入位置、方向和角度的精確性，且可以采用高壓蒸汽消毒，提高手術(shù)的安全性，避免損傷重要結(jié)構(gòu)，可以很大程度上改善患者的就醫(yī)體驗(yàn)。

In order to make the most effective use of your thin film deposition system, it is necessary to understand some of the basic parameters involved in creating thin films. The deposition process can be broadly classified into physical vapor deposition ( PVD ) and chemical vapor deposition ( CVD ). In CVD , the film growth occurs at higher temperatures leading to the development of corrosive gaseous products and might leave impurities on the film. The PVD process can be performed at lower deposition temperatures also leaving corrosive products aside, but deposition rates are lower and it leaves residual compressive stress in the film. Electron beam physical vapor deposition, nevertheless, yields a high deposition rate from 0.1 μm / min to 10 μm / min at relatively low substrate temperatures, with very high material usage efficiency. Due to the very high deposition rate, this process has industrial applications for wear resistant and thermal barrier coatings in aerospace industries, hard coatings for cutting and tool industries, and electronic and optical films for semiconductor industries. In principle, solid evaporant such as powder, granules, lumps, or shaped plug, is placed in the source's copper hearth or in a hearth-liner. A high electron flux produced by hot filament positioned beneath the source is extracted and electro statically and magnetically bent/focused on the top of the evaporant. The electron beam's energy elevates the evaporant's surface temperature. Seldom is the beam rastered to increase the evaporation region. Since the evaporation region is enclosed by cooler (often solid) evaporant, unlike other thermal sources, the e-beam source's vapor plume is chiefly uncontaminated by crucible material. Production scale e-beam sources are usually single pocket (one hearth). Multipocket source (4 or 6 hearths) is available for R & D applications. A cover plate obscures the pockets "not-in-use" to prevent vapor cross talk. Multipocket sources are particularly convenient when depositing multilayer films on a single substrate.