全部評(píng)論(2條)
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- 九元孔探報(bào)告 2013-05-29 00:00:00
- 有高壓軟管，一頭可以像減壓閥都螺紋一樣扭進(jìn)鋼瓶角閥一頭可以扭進(jìn)帶內(nèi)牙的閥門 內(nèi)牙大小一般是1寸的
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- 糖糖小白兔520 2017-11-25 20:46:54
- 減壓閥非常重要，好一點(diǎn)的也就十幾塊錢， 我把你的問題看了好幾遍，實(shí)在想不出不用減壓閥有什么妙用， 老大，不經(jīng)過減壓閥出來的氣壓打得超過你的想象，危險(xiǎn)性極高，求你了，去買一個(gè)吧，就十幾塊錢，
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熱門問答
- 煤氣罐如果不用減壓閥該用什么連接管子呢，求速度解答，給高分
2013-05-28 15:17:59
547
2
- 如果求加速電場的速度沒有給質(zhì)量怎么求
- 如果求加速電場的速度沒有給質(zhì)量怎么求... 如果求加速電場的速度沒有給質(zhì)量怎么求 展開
2017-01-19 06:46:46
382
1
- 煤氣罐減壓閥怎么安裝，求圖解，謝謝！
2012-11-09 00:20:44
407
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- 煤氣罐的減壓閥起什么作用
2017-09-30 20:27:55
342
1
- 液化氣灶不用減壓閥怎么連接
- 買的內(nèi)嵌式爐灶，說明書上說如果是煤氣的就要用減壓閥，液化氣的就不用減壓閥，很是不解啊，是不是說反了啊
2011-01-28 12:58:12
648
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- 煤氣罐減壓閥怎么調(diào)節(jié)？
- 熱水器外面的煤氣罐上有個(gè)減壓閥，怎么調(diào)節(jié)？調(diào)松，是減壓還是增壓？調(diào)緊？請說的詳細(xì)點(diǎn)，準(zhǔn)確點(diǎn)。別說什么逆時(shí)針順時(shí)針的，每個(gè)減壓閥都不一樣，太模糊，沒幫助。
2012-03-06 04:07:37
430
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- 煤氣罐減壓閥的作用
- 是不是有了減壓閥就可以不用關(guān)煤氣管道的開關(guān)了
2013-05-21 19:18:38
648
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- 煤氣罐減壓閥怎么安裝？
2018-11-24 10:06:06
332
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- 煤氣罐減壓閥的壽命
- 煤氣罐減壓閥的壽命是幾年啊 怎么知道改換了那
2010-07-18 19:04:54
524
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- 煤氣罐減壓閥怎么調(diào)？
- 調(diào)緊還是調(diào)松好？有什么作用？減壓閥連著一表是看什么的？是看還有多少煤氣嗎？減壓閥表面有點(diǎn)濕什么問題？煤氣好像用得很快
2017-11-26 18:41:20
737
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- 煤氣罐減壓閥打開漏氣
- 煤氣罐減壓閥打開漏氣打開煤氣后“呲”的一聲，明顯漏氣，正常嗎
2016-12-27 17:44:02
642
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- 煤氣罐有自帶減壓閥么？
2010-05-31 08:49:15
426
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- 煤氣罐減壓閥可以調(diào)多少?
- 家里的液化石油氣罐換了減壓閥后火一直很大，靠調(diào)節(jié)煤氣灶根本不管用，所以想調(diào)節(jié)減壓閥，但我逆時(shí)針擰了半圈，一點(diǎn)效果也沒有。不敢亂擰，特來求助下一般擰多少能看出效果?
2013-09-09 02:42:39
1314
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- 煤氣罐，中壓減壓閥，怎樣調(diào)節(jié)？
- 我買的是飯店炒菜的那種煤氣灶，需要用打火機(jī)點(diǎn)著的。 連接在煤氣瓶上的那個(gè) ，中壓減壓閥，不知道該怎么調(diào)節(jié)？？ 螺絲桿下面有顆螺絲！ 往下調(diào)緊了，火就猛一點(diǎn)，往上調(diào)松了，火就弱一些。 不知道螺絲桿到底調(diào)多高才是合適的？？？diyi次使用，希望懂的朋友... 我買的是飯店炒菜的那種煤氣灶，需要用打火機(jī)點(diǎn)著的。 連接在煤氣瓶上的那個(gè) ，中壓減壓閥，不知道該怎么調(diào)節(jié)？？ 螺絲桿下面有顆螺絲！ 往下調(diào)緊了，火就猛一點(diǎn)，往上調(diào)松了，火就弱一些。 不知道螺絲桿到底調(diào)多高才是合適的？？？diyi次使用，希望懂的朋友能教教我，謝謝了！ 展開
2013-01-30 21:12:37
300
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- 煤氣罐不出氣是不是減壓閥壞了？
2009-05-02 07:40:51
1984
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- 煤氣罐的減壓閥的工作原理
2011-06-17 02:57:55
458
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- 煤氣罐用增壓閥還是減壓閥
2015-08-19 11:07:04
1109
3
- 英譯漢－－給高分，急！！
- Abstract The hollow cathode will be presented as a plasma source for reactive evaporation processes. The hollow cathode generates an arc discharge plasma. This contains a high portion of directed electrons with an enhanced mean energy， the... Abstract The hollow cathode will be presented as a plasma source for reactive evaporation processes. The hollow cathode generates an arc discharge plasma. This contains a high portion of directed electrons with an enhanced mean energy， the so called low voltage electron beam (LVEB). The mean energy of the LVEB， in the range of 11 eV， results in a very effective ionization of the gas and vapor particles. Consequently， very high plasma densities can be achieved， which corresponds to high particle densities in high-rate deposition processes. Furthermore， a high self bias potential of about 16 V is obtained on insulating substrates. For the coating of heat-sensitive substrates with high deposition rates a process with a low ratio between thermal load and deposition rate is necessary. The heat flux on plastic substrates 2 has been measured at the reactive Al evaporation process. The overall thermal load of about 4 W/cm related to a deposition rate of 100nm/ s is low in comparison to other processes. This makes the hollow cathode a favorable tool for the plasma-activated high-rate deposition. The oxide layers deposited by this process show dense and glassy structures even at comparatively low condensation 2 temperatures. This is caused by the high ion current densities in the order of 30 mA/ cm . The low ion energy determined by the self bias potential results in relatively low compressive stress below 100 MPa. The low thermal load and the moderate intrinsic stress of the layers makes the hollow cathode plasma-activated deposition (HAD) process the method of choice for the deposition of oxides as abrasion resistant layers on plastic films and sheets. ó 1998 Elsevier Science S.A. All rights reserved. 1. Introduction Table 1 shows typical layer materials that have been deposited by the PMS–DMS process and the corre-In recent years， the importance of coating plastic sponding dynamic deposition rates. The dynamic deposisurfaces with oxides and nitrides has increased. Typical tion rate is defined for moving substrates as the product of applications are solar control and low-emissivity multilayer the layer thickness and the substrate transportation speed. systems for window panes and window films， antiabrasion The HAD (hollow cathode-activated deposition) process layers on plastic films， plastic sheets and plastic parts as is the combination of a high-rate evaporation process and a well as barrier layers for packaging films. high-density plasma activation using the hollow cathode 展開
2007-04-18 19:12:30
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2016-05-31 09:39:49
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- 如何校正煤氣罐減壓閥，調(diào)亂了
2014-12-23 03:10:54
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